+964 750 905 1010
info [at] helptechco [dot] com
B2B

  • Industry-leading DDR4 overclocking memory
  • High-efficiency forging type heat transfer cooling layer
  • INTEL XMP 2.0 compatible
  • Warranty 1 Years
  • TDRED416G3000HC16AQC01

Team Group whole new overclocking memory series – Team DARK Overclocking memory module is designed for the Intel next generation platform – Skylake Z170 Chipset. Xtreem is developed and certified according to XMP 2.0 standard. With extremely strict burn-in test and worldwide MB certification, it provides the absolute stability and reliability.
Team DARK inherits the multi-color radiating design - high efficiency forged aluminum heat sink which mixes the different colors to create a strong personal style. Team Group leads the industry by releasing the high capacity 16GB kit with clock frequency of up to DDR4 3000. You can experience the high quality performance on Skylake Z170 platform by activating Intel XMP. Team Xtreem overclocking memory is a perfect companion for overclocking enthusiasts!

16GB32GB

TDRED416G3000HC16AQC01
/ /
TeamGroup
/
ITEM SPECIFICATION
Data transfer bandwidth DDR4 2133: 17,064MB/s  (PC4 17,064)
DDR4 2400: 19,200MB/s  (PC4 19,200)
DDR4 2666: 21,328 MB/s  (PC4 21,320)
DDR4 2800: 22,400 MB/s  (PC4 22,400)
DDR4 3000: 24,000 MB/s  (PC4 24,000)
DDR4 3200: 25,600 MB/s  (PC4 25,600)
CL-value DDR4 2133: CL13-15-15-28
DDR4 2400: CL14-16-16-31
DDR4 2666: CL15-15-15-35
DDR4 2800: CL16-16-16-36
DDR4 3000: CL16-16-16-36
                    CL15-15-15-35
DDR4 3200: CL16-16-16-36
Capacity 4GB*4
Working voltage 1.35V
Heat Sink Aluminum heat-sink
Warranty 1 Years
Note With ASUS MAXIMUS VIII HERO(Skylake)
TDRED416G3000HC16AQC01
/ /
TeamGroup
/
Top